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1 Wafer Process
Electronics: WP -
2 Wafer Process Chamber
Electronics: WPCУниверсальный русско-английский словарь > Wafer Process Chamber
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3 lost wafer process
Процесс утонения подложкиТехнология селективного травления кремниевой подложки, в результате которого удаляется её большая часть, а также некоторая часть диффузионного слоя.Англо-русский словарь по нанотехнологиям > lost wafer process
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4 lost wafer process
Процесс утонения подложкиТехнология селективного травления кремниевой подложки, в результате которого удаляется её большая часть, а также некоторая часть диффузионного слоя.Russian-English dictionary of Nanotechnology > lost wafer process
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5 lost wafer process
процес травлення підкладки. Технологія, яка використовує селективне травлення для видалення більшої частини підкладки і частини дифузійного шару, що залишиласяEnglish-Ukrainian dictionary of microelectronics > lost wafer process
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6 wafer
1) напівпровідникова пластина 2) пластина; плата; підкладка - building-block wafer
- bumped wafer
- chem-mesh polished wafer
- composite wafer
- customed wafer
- device wafer
- enhanced gettered wafer
- epitaxial wafer
- etch-separated wafer
- flat wafer
- foundry wafer
- frame-mounted semiconductor wafer
- frame-mounted wafer
- grown-junction wafer
- heavily strained wafer
- IC wafer
- imperfect wafer
- in-process wafer
- low yielding wafer
- LSI wafer
- master-slice wafer
- mixed crystal wafer
- MOS wafer
- multichip [multi-product] wafer
- optically flat wafer
- planar wafer
- p-n wafer
- prediffused wafer
- process development wafer
- processed wafer
- process validation wafer
- production wafer
- raw wafer необроблена пластина
- resist-coated wafer
- sample wafer
- sapphire wafer
- saw-scribed wafer
- scribed wafer
- SOS wafer
- spin-dry wafer
- substrate wafer
- uncommitted wafer
- vapor-phase epitaxial wafer
- (100) wafer -
7 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
8 wafer bumping process
English-German dictionary of Electrical Engineering and Electronics > wafer bumping process
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9 process validation wafer
full wafer memory — память на целой п/п пластине
English-Russian big polytechnic dictionary > process validation wafer
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10 process-development wafer
full wafer memory — память на целой п/п пластине
English-Russian big polytechnic dictionary > process-development wafer
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11 wafer yield
отношение числа годных пластин к общему числу пластин, прошедших обработкуАнгло-русский толковый словарь терминов и сокращений по ВТ, Интернету и программированию. > wafer yield
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12 wafer alignment
<ic.prod> (process and result) ■ Waferjustierung f -
13 wafer coating
<ic.prod> (process and result) ■ Waferbeschichtung f -
14 process technology
Англо-русский толковый словарь терминов и сокращений по ВТ, Интернету и программированию. > process technology
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15 process development wafer
Микроэлектроника: тестовая пластина, применяемая при разработке технологическогоУниверсальный англо-русский словарь > process development wafer
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16 process validation wafer
2) Электроника: тестовая пластина для контроля технологического процесса3) Микроэлектроника: пластина, подвергнутая обработкеУниверсальный англо-русский словарь > process validation wafer
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17 process-development wafer
Универсальный англо-русский словарь > process-development wafer
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18 process validation wafer
Engineering: PVWУниверсальный русско-английский словарь > process validation wafer
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19 process development wafer
тестова пластина, яка застосовується при розробці технологічного процесуEnglish-Ukrainian dictionary of microelectronics > process development wafer
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20 process validation wafer
пластина, піддана (технологічній) обробціEnglish-Ukrainian dictionary of microelectronics > process validation wafer
См. также в других словарях:
lost wafer process — Lost Wafer Process Процесс утонения подложки Технология селективного травления кремниевой подложки, в результате которого удаляется её большая часть, а также некоторая часть диффузионного слоя … Толковый англо-русский словарь по нанотехнологии. - М.
Process corners — In semiconductor manufacturing, a process corner is an example of a design of experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners … Wikipedia
Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… … Wikipedia
Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… … Wikipedia
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
Wafer fabrication — is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. Wafer… … Wikipedia
Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
Wafer prober — A wafer prober is a machine used to test integrated circuits. OverviewIntegrated circuits are fabricated in large numbers by a complex series of printing steps on silicon wafers. This process permits integrated circuits to be produced cheaply but … Wikipedia
process testing wafer — technologijos tikrinimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process testing wafer vok. Testwafer zur Durchführung der Prozeßkontrolle, m rus. пластина для контроля технологического процесса, f pranc. tranche de test… … Radioelektronikos terminų žodynas
process development wafer — technologijos kūrimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process development wafer vok. Testwafer zur Entwicklung der Technologie, m rus. пластина для разработки технологического процесса, f pranc. tranche de test pour … Radioelektronikos terminų žodynas
Process control monitoring — In the application of integrated circuits, process control monitoring (PCM) is the procedur followed to obtain detailed information about the process used. PCM is associated with designing and fabricating special structures that can monitor… … Wikipedia